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TXS0104ERGYRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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TXS0104ERGYRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 26 page YZT (WCSP) PACKAGE (TOP VIEW) D C B A 3 2 1 DESCRIPTION/ORDERING INFORMATION TXS0104E SCES651D – JUNE 2006 – REVISED MAY 2008............................................................................................................................................................... www.ti.com TERMINAL ASSIGNMENTS (YZT Package) 3 2 1 D A4 GND B4 C A3 OE B3 B A2 VCCA B2 A A1 VCCB B1 This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. VCCA must be less than or equal to VCCB. The B port is designed to track VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. The TXS0104E is designed so that the OE input circuit is supplied by VCCA. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. ORDERING INFORMATION TA PACKAGE(1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoFree — WCSP (DSBGA) 0.23-mm Large Bump – YZT Reel of 3000 TXS0104EYZTR 2N7 (Pb-free) 0.625-mm max height) UFBGA – GXU TXS0104EGXUR Reel of 2500 YF04E UFBGA – ZXU (Pb-free) TXS0104EZXUR TXS0104ERGYR QFN – RGY Reel of 1000 YF04E –40 °C to 85°C TXS0104ERGYRG4 TXS0104ED Tube of 50 TXS0104EDG4 SOIC – D TXS0104E TXS0104EDR Reel of 2500 TXS0104EDRG4 TXS0104EPWR TSSOP – PW Reel of 2000 YF04E TXS0104EPWRG4 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 2 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TXS0104E |
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