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S6B0717X01-B0CY Datasheet(PDF) 8 Page - Samsung semiconductor |
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S6B0717X01-B0CY Datasheet(HTML) 8 Page - Samsung semiconductor |
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8 / 65 page  55 COM / 100 SEG DRIVER & CONTROLLER FOR STN LCD S6B0717 4 PAD CONFIGURATION ððð ððððððððððððððððððð - - - - - - - - - - ððððððððððððððððððð ððð Y 117 228 116 229 87 258 86 1 S6B0717 (TOP VIEW) (0,0) X ðððððððððððððððððððððð - - - - - - - - - -ððððððððððððððððððððððð Figure 2. S6B0717 Chip Configuration Table 1. S6B0717 Pad Dimensions Size Item Pad No. X Y Unit Chip size - 9000 2350 1 to 86 90 Pad pitch 87 to 258 70 1 to 86 56 114 87 to 116 108 50 117 to 228 50 108 Bumped pad size 229 to 258 108 50 Bumped pad height 1 to 258 17 (Typ.) µm COG Align Key Coordinate ILB Align Key Coordinate 30 µm 30µm 30µm (-3855, -500) 30 µm 30µm 30µm (+3815, -548) 42 µm 108 µm (-4170, +1065) (+4170, +1065) 42 µm 108 µm |
Similar Part No. - S6B0717X01-B0CY |
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