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RF2461 Datasheet(PDF) 1 Page - RF Micro Devices

Part # RF2461
Description  CDMA/FM LOW NOISE AMPLIFIER/MIXER 900MHZ DOWNCONVERTER
Download  14 Pages
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Manufacturer  RFMD [RF Micro Devices]
Direct Link  http://www.rfmd.com
Logo RFMD - RF Micro Devices

RF2461 Datasheet(HTML) 1 Page - RF Micro Devices

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Preliminary
Product Description
Ordering Information
Typical Applications
Features
Functional Block Diagram
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching® Applied
Si BJT
GaAs MESFET
GaAs HBT
Si Bi-CMOS
SiGe HBT
Si CMOS
IF2+
15
IF2-
14
BYPASS
13
IF1+
12
IF1-
11
10
9
8
7
6
GND1B
5
VCC1
4
LNA IN
3
MIX GAIN
2
LNA GAIN
1
20
19
18
17
16
RF2461
CDMA/FM LOW NOISE AMPLIFIER/MIXER
900MHZ DOWNCONVERTER
• CDMA/FM Cellular Systems
• Supports Dual-Mode AMPS/CDMA
• Supports Dual-Mode TACS/JCDMA
• General Purpose Downconverter
• Commercial and Consumer Systems
• Portable Battery-Powered Equipment
The RF2461 is a receiver front-end designed for the
receive section of dual-mode CDMA/FM cellular applica-
tions. It is designed to amplify and downconvert RF sig-
nals, while providing 30dB of stepped gain control range.
Features include digital control of LNA gain, mixer gain,
and power down mode. Another feature of the chip is
adjustable IIP3 of the LNA and mixer using an off-chip
current setting resistor. Noise figure, IP3, and other specs
are designed to be compatible with the IS-98B interim
standard for CDMA cellular communications. The IC is
manufactured on an advanced Silicon Germanium HBT
process and is in a 4 mmx4mm, 20-pin, leadless chip car-
rier.
• Complete Receiver Front-End
• Stepped LNA/Mixer Gain Control
• Adjustable LNA/Mixer Bias Current
• Adjustable LNA/Mixer IIP3
• Meets IMD Tests with Three Gain States/
Two Logic Control Lines
RF2461
CDMA/FM Low Noise Amplifier/Mixer 900MHz
Downconverter
RF2461 PCBA
Fully Assembled Evaluation Board
8
Rev A13 010607
1.00
0.90
4.00
sq.
0.60
0.24 typ
3
0.20
0.75
0.50
0.23
0.13
4PLCS
0.50
2.10
sq.
0.65
0.30
4PLCS
0.05
12°
MAX
Dimensions in mm.
Note orientation of package.
NOTES:
Package Warpage: 0.05 mm max.
4
Die Thickness Allowable: 0.305 mm max.
5
Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
2
Shaded lead is Pin 1.
1
Dimension applies to plated terminal: to be measured between 0.02 mm
and 0.25 mm from terminal end.
3
Package Style: LCC, 20-Pin, 4x4


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