Chip 3-Terminal Capacitor Array

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Preheating

Peak

Heating

Time

The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,

Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.

1. Take measures against mechanical stress during and after mounting of Chip 3-Terminal Capacitor Array (hereafter

called the capacitor arrays) so as not to damage their electrodes and protective coatings.

Be careful not to misplace the capacitor arrays on the land patterns. Otherwise, solder bridging may occur.

2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the capacitors arrays'

performance and/or reliability.

3. When soldering with a soldering iron, never touch the capacitor arrays' bodies with the tip of the soldering iron. When

using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °

C max.).

4. As the amount of applied solder becomes larger, the mechanical stress applied to the capacitor arrays increases,

causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.

5. Do not apply shock to the capacitor arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the

capacitor arrays' protective coatings and bodies may be chipped, affecting their performance.

6. Avoid excessive bending of printed circuit boards in order to protect the capacitor arrays from abnormal stress.

7. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to

dielectric materials having a high dielectric constant.

● Recommended soldering conditions for reflow

Recommendations and precautions are described below.

● Flow Soldering

We do not recommend flow soldering to the Chip 3-Terminal Capacitor Array: EZASC, because solder

bridging may occur due to the narrow 0.8 mm pitch of EZASC. Please contact us regarding flow soldering

of EZANC type.

Safety Precautions

·Reflow soldering shall be performed a maximum of

two times.

·Please contact us for additional information when

used in conditions other than those specified.

·Please measure the temperature of the terminals and

study every kind of solder and printed circuit board

for solderability before actual use.

For soldering (Example : Sn/Pb)

Temperature

Time

Preheating

140 °C to 160 °C

60 s to 120 s

Main heating

Above 200 °C

30 s to 40 s

Peak

235 ± 5 °C

max. 10 s

Temperature

Time

Preheating

150 °C to 180 °C

60 s to 120 s

Main heating

Above 230 °C

30 s to 40 s

Peak

max. 260 °C

max. 10 s

For lead-free soldering (Example : Sn/Ag/Cu)

Feb. 2006