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Product data sheet

Rev. 01 — 13 May 2005

25 of 28

Philips Semiconductors

SSTUH32866

1.8 V high-drive DDR2 configurable registered buffer with parity

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250

°C

or 265

°C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most

applications.

13.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be

limited to 10 seconds at up to 300

°C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270

°C and 320 °C.

13.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reflow soldering with

peak temperature exceeding 217

°C ± 10 °C measured in the atmosphere of the reflow oven. The package

body peak temperature must be kept as low as possible.

Table 11:

Suitability of surface mount IC packages for wave and reflow soldering methods

Soldering method

Wave

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

suitable

suitable

suitable

LQFP, QFP, TQFP

suitable

SSOP, TSSOP, VSO, VSSOP

suitable

not suitable

not suitable