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RF2131PCBA Datasheet(PDF) 3 Page - RF Micro Devices

Part # RF2131PCBA
Description  HIGH EFFICIENCY AMPS/ETACS AMPLIFIER
Download  10 Pages
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Manufacturer  RFMD [RF Micro Devices]
Direct Link  http://www.rfmd.com
Logo RFMD - RF Micro Devices

RF2131PCBA Datasheet(HTML) 3 Page - RF Micro Devices

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2-101
RF2131
Rev B4 010417
2
Pin
Function
Description
Interface Schematic
1PC
Power Control. When this pin is "low", all circuits are shut off. A "low" is
typically 0.5V or less at room temperature. During normal operation
this pin is the power control. Control range varies from about 2V for
0dBm to 3.6V for +31dBm RF output power. The maximum power that
can be achieved depends on the actual output matching; see the appli-
cation information for more details.
2NC
Not connected.
3VCC2
Power supply for the driver stage and interstage matching. A shunt
capacitor is required for tuning the interstage to the proper frequency.
The value of this capacitor depends on the operating frequency and
power level. See the application information for details.
4GND
Ground connection. Keep traces physically short and connect immedi-
ately to the ground plane for best performance.
5GND
Same as pin 4.
6GND1
Ground connection for the driver stage. Keep traces physically short
and connect immediately to the ground plane for best performance. It is
recommended to use separate vias to the ground plane for this return
path.
Seepin 1schematic.
7RF IN
RF Input. This is a 50
Ω input, but the actual impedance depends on the
interstage matching network connected to pin 3. An external DC block-
ing capacitor is required if this port is connected to a DC path to ground
or a DC voltage.
Seepin 3schematic.
8VCC1
Power supply for the bias circuits. An external RF bypass capacitor is
required. Keep the traces to the capacitor as short as possible, and
connect the capacitor immediately to the ground plane.
Seepin 1schematic.
9NC
This pin is not connected internally; however it needs to be connected
to ground externally. This will improve performance by reducing cou-
pling between pins.
10
RF OUT
RF Output and power supply for the output stage. The four output pins
are combined, and bias voltage for the final stage is provided through
these pins. The external path must be kept symmetric until combined to
ensure stability. An external matching network is required to provide the
optimum load impedance; see the application schematics for details.
11
RF OUT
Same as pin 10.
See pin 10 schematic.
12
GND
Ground connection for the output stage. Keep traces physically short
and connect immediately to the ground plane for best performance.
13
GND
Ground connection for the output stage. Keep traces physically short
and connect immediately to the ground plane for best performance.
14
RF OUT
Same as pin 10.
See pin 10 schematic.
15
RF OUT
Same as pin 10.
See pin 10 schematic.
16
NC
This pin is not connected internally, however it needs to be connected
to ground externally. This will improve performance by reducing cou-
pling between pins.
80
PC
VCC1
To Bias
Stages
RF IN
VCC2
From Bias
Stages
RF OUT
From Bias
Stages


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