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CC2530F128RHAR Datasheet(PDF) 3 Page - Texas Instruments |
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CC2530F128RHAR Datasheet(HTML) 3 Page - Texas Instruments |
3 / 30 page ABSOLUTE MAXIMUM RATINGS (1) RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. MIN MAX UNIT Supply voltage All supply pins must have the same voltage –0.3 3.9 V –0.3 VDD + 0.3, Voltage on any digital pin V ≤ 3.9 Input RF level 10 dBm Storage temperature range –40 125 °C All pads, according to human-body model, JEDEC STD 22, method 2 kV A114 ESD(2) According to charged-device model, JEDEC STD 22, method C101 500 V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage. MIN MAX UNIT Operating ambient temperature range, TA –40 125 °C Operating supply voltage 2 3.6 V Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Digital regulator on. 16-MHz RCOSC running. No radio, crystals, or peripherals active. 3.4 mA Medium CPU activity: normal flash access(1), no RAM access 32-MHz XOSC running. No radio or peripherals active. 6.5 8.9 mA Medium CPU activity: normal flash access(1), no RAM access 32-MHz XOSC running, radio in RX mode, –50-dBm input 20.5 mA power, no peripherals active, CPU idle 32-MHz XOSC running, radio in RX mode at -100-dBm input 24.3 29.6 mA power (waiting for signal), no peripherals active, CPU idle 32-MHz XOSC running, radio in TX mode, 1-dBm output 28.7 mA Icore Core current consumption power, no peripherals active, CPU idle 32-MHz XOSC running, radio in TX mode, 4.5-dBm output 33.5 39.6 mA power, no peripherals active, CPU idle Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD 0.2 0.3 mA and sleep timer active; RAM and register retention Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and 1 2 µA sleep timer active; RAM and register retention Power mode 3. Digital regulator off; no clocks; POR active; 0.4 1 µA RAM and register retention (1) Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently. Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 |
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