NLSX4014

http://onsemi.com

11

PACKAGE DIMENSIONS

UQFN12 1.7x2.0, 0.4P

CASE 523AE−01

ISSUE A

A

b

A1

0.05 C

SEATING

PLANE

NOTE 3

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND 0.30 MM

FROM TERMINAL TIP.

4. MOLD FLASH ALLOWED ON TERMINALS

ALONG EDGE OF PACKAGE. FLASH 0.03

MAX ON BOTTOM SURFACE OF

TERMINALS.

5. DETAIL A SHOWS OPTIONAL

CONSTRUCTION FOR TERMINALS.

DIM

MIN

MAX

MILLIMETERS

A

A1

0.40 BSC

0.45

0.55

b

D

0.45

0.55

E

e

L

0.00

0.05

PIN 1 REFERENCE

D

A

E

B

0.10 C

2X

0.10 C

2X

0.05 C

C

K

7

5

1

11

12X

e

L

12X

2.00 BSC

0.15

0.25

12X

A3

DETAIL B

8X

L2

DETAIL B

OPTIONAL

CONSTRUCTION

0.15 REF

L2

K

0.127 REF

A3

1.70 BSC

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 5

L1

DETAIL A

DETAIL A

B

A

C

C

M

0.10

M

0.05

0.32

11X

2.30

0.69

0.40

DIMENSIONS: MILLIMETERS

MOUNTING FOOTPRINT

1

SOLDERMASK DEFINED

0.00

0.03

L1

0.22

2.00

PITCH

12X

0.20

----

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.