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NIS5135MN1TXG Datasheet(PDF) 3 Page - ON Semiconductor |
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NIS5135MN1TXG Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 12 page NIS5135 http://onsemi.com 3 Table 1. FUNCTIONAL PIN DESCRIPTION Pin Function Description 1−5 Source This pin is the source of the internal power FET and the output terminal of the fuse. 7 ILimit A resistor between this pin and the source pin sets the overload and short circuit current limit levels. 8 Enable/Fault The enable/fault pin is a tri−state, bidirectional interface. It can be used to enable or disable the output of the device by pulling it to ground using an open drain or open collector device. If a thermal fault occurs, the voltage on this pin will go to an intermediate state to signal a monitoring circuit that the device is in thermal shutdown. It can also be connected to another device in this family to cause a simultaneous shutdown during thermal events. 9 dv/dt The internal dv/dt circuit controls the slew rate of the output voltage at turn on. It has an internal capacitor that allows it to ramp up over a period of 2 ms. An external capacitor can be added to this pin to increase the ramp time. If an additional time delay is not required, this pin should be left open. 10 Ground Negative input voltage to the device. This is used as the internal reference for the IC. 11 (belly pad) VCC Positive input voltage to the device. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage, operating, steady−state (VCC to GND, Note 1) Transient (100 ms) VIN −0.6 to 18 −0.6 to 25 V Thermal Resistance, Junction−to−Air 0.1 in2 copper (Note 2) 0.5 in2 copper (Note 2) qJA 227 95 °C/W Thermal Resistance, Junction−to−Lead (Pin 1) qJL 27 °C/W Thermal Resistance, Junction−to−Case qJC 20 °C/W Total Power Dissipation @ TA = 25°C Derate above 25°C Pmax 1.3 10.4 W mW/°C Operating Temperature Range (Note 3) TJ −40 to 150 °C Nonoperating Temperature Range TJ −55 to 155 °C Lead Temperature, Soldering (10 Sec) TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Negative voltage will not damage device provided that the power dissipation is limited to the rated allowable power for the package. 2. 1 oz copper, double−sided FR4. 3. Thermal limit is set above the maximum thermal rating. It is not recommended to operate this device at temperatures greater than the maximum ratings for extended periods of time. |
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