NCV8851

http://onsemi.com

3

PACKAGE PIN DESCRIPTIONS − 20 Lead TSSOP

Package Pin#

Pin Symbol

Function

1

SYNC

External clock synchronization input.

2

Supply input for the internal current sense amplifier.

3

Supply input for internal logic and analog circuitry.

4

BST

5

GH

Gate driver output for the external high−side NMOS FET.

6

Switch−node. This pin connects to the source of the high−side MOSFET and drain of the

low−side MOSFET. This pin serves as the switch output to the inductor.

7

GL

Gate driver output for the external low−side NMOS FET.

8

PGND

Power Ground. Ground reference for the high−current path including the NMOS FETs and

output capacitor.

9

Output of internal fixed 6.0 V LDO.

10

AGND

and the compensators.

11

EN

Enable input. When disabled, the LDO, internal logic and analog circuitry and gate drivers

enter sleep mode, drawing under 1 mA.

12

Supply input for the SMPS.

13

through a resistive divider.

14

SMPS’s voltage error amplifier output and non−inverting input to the current error amplifier.

15

SMPS’s current error amplifier output and inverting input to the PWM comparator.

16

SMPS’s current feedback. Inverting input to the current error amplifier.

17

resistor. Non−inverting input to the cycle−by−cycle overcurrent comparator.

18

CSN

Differential current sense amplifier inverting input.

19

CSP

Differential current sense amplifier non−inverting input.

20

Oscillator’s frequency adjust pin. Resistor to ground sets the oscillator frequency.

Rating

Value

Unit

Peak Transient Voltage (Load Dump, EN = 0 V)

−0.3 to 20

45

V

46

V

6.5

V

t

−0.7 to 40.7

−2

V

Pin Voltage (BST, GH)

46 wrt PGND

V

Pin Voltage (GL)

−0.3 to 7 wrt PGND

V

Pin Voltage (EN)

−0.3 to 40

V

Pin Voltage (CSP, CSN)

−0.3 to 10

V

−0.3 to 7

V

Pin Voltage (PGND)

−0.3 to 0.3

V

Operating Junction Temperature

−40 to 150

°C

Storage Temperature Range

−65 to 150

°C

Peak Reflow Soldering Temperature: Lead−free 60 to 150 seconds at 217°C

265 peak

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.