NCV8570

http://onsemi.com

2

Figure 2. Simplified Block Diagram

Current

Limit

Bandgap

Reference

Voltage

CE

GND

Active

Discharge

PIN FUNCTION DESCRIPTION

Pin No.

DFN6

TSOP−5

Pin Name

Description

1

3

CE

Chip Enable: This pin allows on/off control of the regulator. To disable the device, connect to

ted between CE and GND.

2, 5, EPAD

2

GND

Power Supply Ground (Pins are fused for the DFN package)

3

1

Power Supply Input Voltage

4

5

Regulated Output Voltage

6

4

Noise reduction pin. (Connect 100 nF or 10 nF capacitor to GND)

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage (Note 1)

−0.3 V to 6 V

V

Chip Enable Voltage

V

Noise Reduction Voltage

V

Output Voltage

V

Maximum Junction Temperature (Note 1)

150

°C

Storage Temperature Range

−55 to 150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device series contains ESD protection and exceeds the following tests:

Human Body Model 2000 V per MIL−STD−883, Method 3015

Machine Model Method 200 V

This device series meets or exceeds AEC Q100 standard.

THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Package Thermal Resistance, DFN6: (Note 1)

Junction−to−Lead (pin 2)

Junction−to−Ambient

37

120

°C/W

Package Thermal Resistance, TSOP−5: (Note 1)

Junction−to−Lead (pin 5)

Junction−to−Ambient

109

220

°C/W

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area