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NCV8535MN330R2G Datasheet(PDF) 4 Page - ON Semiconductor |
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NCV8535MN330R2G Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 22 page NCV8535 http://onsemi.com 4 PIN FUNCTION DESCRIPTION Fixed Version Pin No. Pin Name Description 1, 2 Vout Regulated output voltage. Bypass to ground with Cout w 1.0 mF. 3 SENSE For output voltage sensing, connect to Pins 1 and 2. 4 GND Power Supply Ground 7 NR Noise Reduction Pin. This is an optional pin used to further reduce noise. 8 SD Shutdown pin. When not in use, this pin should be connected to the input pin. 9, 10 Vin Power Supply Input Voltage 5, 6 NC Not Connected EPAD EPAD Exposed thermal pad should be connected to ground. Adjustable Version 1, 2 Vout Regulated output voltage. Bypass to ground with Cout w 1.0 mF. 3 Adj Adjustable pin; reference voltage = 1.25 V. 4 GND Power Supply Ground 7 NR Noise Reduction Pin. This is an optional pin used to further reduce noise. 8 SD Shutdown pin. When not in use, this pin should be connected to the input pin. 9, 10 Vin Power Supply Input Voltage 5, 6 NC Not Connected EPAD EPAD Exposed thermal pad should be connected to ground. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Vin −0.3 to +16 V Output Voltage Vout −0.3 to Vin +0.3 or 10 V* V Shutdown Pin Voltage Vsh −0.3 to +16 V Junction Temperature Range TJ −40 to +150 °C Storage Temperature Range Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM) tested per AEC−Q100−002 (EIA/JESD22−A114) Machine Model (MM) tested per AEC−Q100−003 (EIA/JESD22−A115) Charged Device Model (CDM) tested per EIA/JESD22−C101 *Which ever is less. Reverse bias protection feature valid only if Vout − Vin ≤ 7 V. THERMAL CHARACTERISTICS Characteristic Test Conditions (Typical Value) Unit Min Pad Board (Note 1) 1, Pad Board (Note 1) Junction−to−Air, qJA 215 66 °C/W Junction−to−Pin, yJL2 55 17 °C/W 1. As mounted on a 35 x 35 x 1.5 mm FR4 Substrate, with a single layer of a specified copper area of 2 oz (0.07 mm thick) copper traces and heat spreading area. JEDEC 51 specifications for a low and high conductivity test board recommend a 2 oz copper thickness. Test conditions are under natural convection or zero air flow. |
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