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NCV7703D2R2G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NCV7703D2R2G
Description  Triple Half-Bridge Driver with SPI Control
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV7703D2R2G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2008
September, 2008 − Rev. 2
1
Publication Order Number:
NCV7703/D
NCV7703
Triple Half-Bridge Driver
with SPI Control
The NCV7703 is a fully protected Triple Half−Bridge Driver
designed specifically for automotive and industrial motion control
applications. The three half−bridge drivers have independent control.
This allows for high side, low side, and H−Bridge control. H−Bridge
control provides forward, reverse, brake, and high impedance states.
The drivers are controlled via a standard SPI (Serial Peripheral
Interface). This device is fully compatible with ON Semiconductor’s
NCV7708 Double Hex Driver.
Features
• Ultra Low Quiescent Current in Sleep Mode, 1 mA for VS and VCC
• Power Supply Voltage Operation down to 5 V
• 3 High−Side and 3 Low−Side Drivers Connected as Half−Bridges
• Internal Free−Wheeling Diodes
• Configurable as H−Bridge Drivers
• 0.5 A Continuous (1 A peak) Current
• RDS(on) = 0.8 W (typ)
• 5 MHz SPI Control with Daisy Chain Capability
• Compliance with 5 V and 3.3 V Systems
• Overvoltage and Undervoltage Lockout
• Fault Reporting
• 1.4 A Overcurrent Threshold Detection with Optional Shutdown
• 3 A Current Limit with Auto Shutdown
• Overtemperature Warning and Protection Levels
• Internally Fused Leads in SOIC−14 Package for Better Thermal
Performance
• ESD Protection up to 6 kV
• This is a Pb−Free Device
Typical Applications
• Automotive
• Industrial
• DC Motor Management
M
M
OUT1
OUT2
OUT3
Figure 1. Cascaded Application
VS
VS
VS
Device
Package
Shipping†
ORDERING INFORMATION
MARKING DIAGRAM
SOIC−14
D2 SUFFIX
CASE 751A
PIN CONNECTIONS
http://onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
NCV7703D2G
SOIC−14
(Pb−Free)
55 Units / Rail
NCV7703D2R2G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
1
14
NCV7703G
AWLYWW
1
14
NCV7703 = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
Y
= Year
WW
= Work Week
G
= Pb−Free Package
GND
OUT3
VS
CSB
SI
SCLK
GND
GND
OUT1
OUT2
VCC
EN
SO
GND


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