NCV7703B

http://onsemi.com

4

MAXIMUM RATINGS

Rating

Value

Unit

(DC)

(AC), t < 500 ms, Ivs > −2 A

−0.3 to 40

−1

V

Output Pin OUTx

(DC)

(AC), t < 500 ms, IOUTx > −2 A

−0.3 to 40

−1

V

Pin Voltage

−0.3 to 7

V

Output Current (OUTx)

(DC)

(AC) (50 ms pulse, 1 s period)

−1.8 to 1.8

Internally Limited

A

Electrostatic Discharge, Human Body Model,

6

kV

Electrostatic Discharge, Human Body Model,

all other pins (Note 3)

2

kV

Electrostatic Discharge, Machine Model,

300

V

Electrostatic Discharge, Machine Model,

all other pins (Note 3)

200

V

Electrostatic Discharge, Charge Device Model (Note 3)

1

kV

Operating Junction Temperature

−40 to 150

°C

Storage Temperature Range

−55 to 150

°C

Moisture Sensitivity Level (MAX 260°C Processing)

MSL3

−

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Thermal Parameters

Test Conditions (Typical Value)

Unit

14 Pin Fused SOIC Package

min−pad board

(Note 1)

1″ pad board

(Note 2)

23

22

°C/W

122

83

°C/W

3. This device series incorporates ESD protection and is tested by the following methods:

ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115)

ESD CDM tested per EIA/JES D22/C101, Field Induced Charge Model