NCP5623

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10

PACKAGE DIMENSIONS

TSSOP−14

CASE 948G−01

ISSUE B

DIM MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

4.90

5.10 0.193 0.200

B

4.30

4.50 0.169 0.177

C

−−−

1.20

−−− 0.047

D

0.05

0.15 0.002 0.006

F

0.50

0.75 0.020 0.030

G

0.65 BSC

0.026 BSC

H

0.50

0.60 0.020 0.024

J

0.09

0.20 0.004 0.008

J1

0.09

0.16 0.004 0.006

K

0.19

0.30 0.007 0.012

K1

0.19

0.25 0.007 0.010

L

6.40 BSC

0.252 BSC

M

0

8

0

8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL

IN EXCESS OF THE K DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

___

_

S

U

0.15 (0.006) T

2X

L/2

S

U

M

0.10 (0.004)

T

L

−U−

SEATING

PLANE

0.10 (0.004)

−T−

SECTION N−N

DETAIL E

J J1

K

K1

DETAIL E

F

M

−W−

0.25 (0.010)

8

14

7

1

PIN 1

IDENT.

H

G

A

D

C

B

S

U

0.15 (0.006) T

−V−

14X

REF

K

N

N

7.06

14X

0.36

14X

1.26

0.65

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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