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SN74LVC1G10DCKR Datasheet(PDF) 1 Page - Texas Instruments

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Part # SN74LVC1G10DCKR
Description  SINGLE 3-INPUT POSITIVE-NAND GATE
Download  15 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC1G10DCKR Datasheet(HTML) 1 Page - Texas Instruments

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FEATURES
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G10
SINGLE 3-INPUT POSITIVE-NAND GATE
SCES486D – SEPTEMBER 2003 – REVISED JANUARY 2007
• Available in the Texas Instruments
Operation
NanoFree™ Package
• Latch-Up Performance Exceeds 100 mA per
• Supports 5-V V
CC Operation
JESD 78, Class II
• Inputs Accept Voltages to 5.5 V
• ESD Protection Exceeds JESD 22
• Max t
pd of 3.8 ns at 3.3 V
2000-V Human-Body Model (A114-A)
• Low Power Consumption, 10-µA Max I
CC
200-V Machine Model (A115-A)
• ±24-mA Output Drive at 3.3 V
1000-V Charged Device Model (C101)
• I
off Supports Partial-Power-Down Mode
The SN74LVC1G10 performs the Boolean function Y = A
• B • C or Y = A + B + C in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000
SN74LVC1G10YZPR
_ _ _C2_
0.23-mm Large Bump – YZP (Pb-free)
–40°C to 85°C
SOT (SOT-23) – DBV
Reel of 3000
SN74LVC1G10DBVR
C10_
SOT (SC-70) – DCK
Reel of 3000
SN74LVC1G10DCKR
C2_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
• = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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