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CC430F5135IRGZ Datasheet(PDF) 88 Page - Texas Instruments

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Part No. CC430F5135IRGZ
Description  MSP430 SoC with RF Core
Download  118 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

CC430F5135IRGZ Datasheet(HTML) 88 Page - Texas Instruments

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ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F613x
CC430F612x
CC430F513x
SLAS554D – MAY 2009 – REVISED JULY 2010
www.ti.com
Table 46. Bill of Materials
Component(s)
for 315 MHz
for 433 MHz
for 868/915 MHz
Comment
C1,3,4,5,7,9,11,13,15
100 nF
Decoupling capacitors
C8,10,12,14
10 µF
Decoupling capacitors
C2,6,16,17,18
2 pF
Decoupling capacitors
C19
470 nF
VCORE capacitor
RST decoupling cap
C20
2.2 nF
(optimized for SBW)
Load capacitors for
C21,22
27 pF
26 MHz crystal(1)
R1
56 k
Ω
R_BIAS (±1% required)
R2
47k
Ω
RST pullup
L1,2
Capacitors: 220 pF
0.016 µH
0.012 µH
L3,4
0.033 µH
0.027 µH
0.018 µH
L5
0.033 µH
0.047 µH
0.015 µH
L6
dnp(2)
dnp(2)
0.0022 µH
L7
0.033 µH
0.051 µH
0.015 µH
C23
dnp(2)
2.7 pF
1 pF
C24
220 pF
220 pF
100 pF
C25
6.8 pF
3.9 pF
1.5 pF
C26
6.8 pF
3.9 pF
1.5 pF
C27
220 pF
220 pF
1.5 pF
C28
10 pF
4.7 pF
8.2 pF
C29
220 pF
220 pF
1.5 pF
(1)
The load capacitance CL seen by the crystal is CL = 1/((1/C21)+(1/C22)) + Cparasitic. The parasitic capacitance Cparasitic includes pin
capacitance and PCB stray capacitance. It can be typically estimated to be around 2.5 pF.
(2)
dnp: do not populate.
88
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Copyright © 2009–2010, Texas Instruments Incorporated


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