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CC430F5135IRGZ Datasheet(PDF) 84 Page - Texas Instruments

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Part No. CC430F5135IRGZ
Description  MSP430 SoC with RF Core
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

CC430F5135IRGZ Datasheet(HTML) 84 Page - Texas Instruments

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ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F613x
CC430F612x
CC430F513x
SLAS554D – MAY 2009 – REVISED JULY 2010
www.ti.com
Frequency Synthesizer Characteristics
TA = 25°C, VCC = 3 V (unless otherwise noted)
(1)
MIN figures are given using a 27MHz crystal. TYP and MAX figures are given using a 26MHz crystal.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Programmed frequency resolution(2)
26 to 27 MHz crystal
397
fXOSC/2
16
412
Hz
Synthesizer frequency tolerance(3)
±40
ppm
50 kHz offset from carrier
–95
100 kHz offset from carrier
–94
200 kHz offset from carrier
–94
500 kHz offset from carrier
–98
RF carrier phase noise
dBc/Hz
1 MHz offset from carrier
–107
2 MHz offset from carrier
–112
5 MHz offset from carrier
–118
10 MHz offset from carrier
–129
PLL turn-on / hop time(4)
Crystal oscillator running
85.1
88.4
88.4
µs
PLL RX/TX settling time(5)
9.3
9.6
9.6
µs
PLL TX/RX settling time(6)
20.7
21.5
21.5
µs
PLL calibration time(7)
694
721
721
µs
(1)
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).
(2)
The resolution (in Hz) is equal for all frequency bands.
(3)
Depends on crystal used. Required accuracy (including temperature and aging) depends on frequency band and channel bandwidth /
spacing.
(4)
Time from leaving the IDLE state until arriving in the RX, FSTXON or TX state, when not performing calibration.
(5)
Settling time for the 1-IF frequency step from RX to TX
(6)
Settling time for the 1-IF frequency step from TX to RX
(7)
Calibration can be initiated manually or automatically before entering or after leaving RX/TX
84
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Copyright © 2009–2010, Texas Instruments Incorporated


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