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NCP1117LPST18T3G Datasheet(PDF) 2 Page - ON Semiconductor |
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NCP1117LPST18T3G Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 14 page NCP1117LP http://onsemi.com 2 Figure 3. Block Diagram Table 1. PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 Adj (GND) A resistor divider from this pin to the Vout pin and ground sets the output voltage (Ground only for Fixed−Mode). 2 Vout The output of the regulator. A minimum of 10 mF capacitor (20 mW ≤ ESR ≤ 20 W) must be connec- ted from this pin to ground to insure stability. 3 Vin The input pin of regulator. Typically a large storage capacitor (20 mW ≤ ESR ≤ 20 W) is connected from this pin to ground to insure that the input voltage does not sag below the minimum dropout voltage during the load transient response. This pin must always be 1.3 V (typ.) higher than Vout in order for the device to regulate properly. Table 2. MAXIMUM RATINGS Rating Symbol Value Unit DC Input Voltage Vin −0.3 to 18 V Operating Junction Temperature Range TOP 0 to 125 °C Operating Ambient Temperature Range TA 0 to 125 °C Maximum Junction Temperature Range TJ(max) −55 to 150 °C Power Dissipation and Thermal Characteristics − Power Dissipation (Note 1) − Thermal Resistance, Junction−to−Ambient (Note 2) − Thermal Resistance, Junction−to−Case PD RqJA RqJC Internally Limited 108 15 W °C/W °C/W Electrostatic Discharge Human Body Model ESD 2000 V Machine Model 200 Storage Temperature Range TSTG −65 to 150 °C NOTE: This device series contains ESD protection and exceeds the following tests: ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114) ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115) Latch–up Current Maximum Rating: ≤ 150mA per JEDEC standard: JESD78 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: All voltages are referenced to GND pin. 1. The maximum package power dissipation is: PD + TJ(max) * TA RqJA 2. RqJA on a 100 x 100 mm PCB Cu thickness 1 oz; TA = 25°C |
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