NCP508

http://onsemi.com

15

PACKAGE DIMENSIONS

WDFN6 1.5x1.5, 0.5P

CASE 511BJ−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30mm FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

C

A

SEATING

PLANE

D

E

0.10 C

A3

A

A1

2X

2X

0.10 C

DIM

A

MIN

MAX

MILLIMETERS

0.70

0.80

A1

0.00

0.05

A3

0.20 REF

b

0.20

0.30

D

E

e

L

PIN ONE

REFERENCE

0.05 C

0.05 C

A

0.10 C

NOTE 3

L2

e

b

B

3

6

6X

1

4

0.05 C

MOUNTING FOOTPRINT*

L1

1.50 BSC

1.50 BSC

0.50 BSC

0.40

0.60

---

0.15

BOTTOM VIEW

L

5X

DIMENSIONS: MILLIMETERS

0.73

6X

0.35

5X

1.80

0.50

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

A1

A3

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL B

DETAIL A

L2

0.50

0.70

TOP VIEW

B

SIDE VIEW

NOTE 4

RECOMMENDED

0.83

ON Semiconductor and

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