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MC10H605FNR2 Datasheet(PDF) 4 Page - ON Semiconductor |
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MC10H605FNR2 Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 7 page MC10H605, MC100H605 http://onsemi.com 4 Table 5. TTL DC CHARACTERISTICS (VCCT = +5.0 V ±10%; VEE = −5.2 V ±5% (10H); VEE = −4.2 V to 5.5 V (100H); VCCE = GND = 0 V) Symbol Characteristic Condition 0°C 25°C 85°C Unit Min Typ Max Min Typ Max Min Typ Max ICCL Supply Current Outputs Low 65 75 65 75 65 75 mA ICCH Supply Current Outputs High 65 75 65 75 65 75 mA VOL Output Low Voltage IOL = 24 mA 500 500 500 mV VOH Output High Voltage IOH = 24 mA 2.5 2.5 2.5 mV IOS Output Short Circuit Current VOUT = 0 V 100 225 100 225 100 225 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Table 6. AC TEST LIMITS (VCCT = +5.0 V ±10%; VEE = −5.2 V ±5% (10H); VEE = −4.2 V to 5.5 V (100H); VCCE = GND = 0 V) Symbol Characteristic Condition 0°C 25°C 85°C Unit Min Typ Max Min Typ Max Min Typ Max tPLH Propagation Delay CLK to Q (Diff) CLK to Q (SE) Across P.S. and Temp CL = 50 pF 4.5 4.3 5.3 5.3 6.5 6.7 4.5 4.3 5.4 5.4 6.5 6.7 4.5 4.3 5.6 5.6 6.5 6.7 ns tPHL Propagation Delay CLK to Q (Diff) CLK to Q (SE) Across P.S. and Temp CL = 50 pF 4.0 3.8 5.0 5.0 6.0 6.2 4.0 3.8 5.1 5.1 6.0 6.2 4.0 3.8 5.5 5.5 6.0 6.2 ns tPHL Propagation Delay MR to Q Across P.S. and Temp CL = 50 pF 2.5 4.9 7.0 2.5 5.2 7.0 3.0 5.8 7.5 ns tSKEW Device Skew Part−to−Part (Diff) Within−Device CL = 50 pF 1.0 0.3 2.0 0.7 1.0 0.3 2.0 0.7 1.0 0.3 2.0 0.7 ns tS Setup Time 1.5 1.5 1.5 ns tH Hold Time 1.5 1.5 1.5 ns tPW Minimum Pulse Width CLK 1.0 1.0 1.0 ns tPW Minimum Pulse Width MR 1.0 1.0 1.0 ns VPP Minimum Input Swing Peak−to−Peak 150 150 150 mV tr Rise Time 1.0 V to 2.0 V 0.7 1.0 1.5 0.7 1.0 1.5 0.7 1.0 1.5 ns tf Fall Time 1.0 V to 2.0 V 0.5 0.7 1.2 0.5 0.7 1.2 0.5 0.7 1.2 ns tRR Reset/Recovery Time 2.5 2.5 2.5 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. |
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