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CM1236-08DE Datasheet(PDF) 5 Page - ON Semiconductor |
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CM1236-08DE Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 14 page CM1236 Rev. 3 | Page 5 of 14 | www.onsemi.com CM1236 Inductor Elements In the CM1236 PicoGuard XS architecture, the inductor elements and ESD protection diodes interact differently compared to the standard ESD model. In the standard ESD protection device model, the inductive element presents high impedance against high slew rate strike voltage, i.e. during an ESD strike. The impedance increases the resistance of the conduction path leading to the ESD protection element. This limits the speed that the ESD pulse can discharge through the ESD protection element. In the PicoGuard XS architecture, the inductive elements are in series to the conduction path leading to the protected device. The elements actually help to limit the current and voltage striking the protected device. First the reactance of the inductive element, L1, on the connector side when an ESD strike occurs, acts in the opposite direction of the ESD striking current. This helps limit the peak striking voltage. Then the reactance of the inductive element, L2, on the ASIC side forces this limited ESD strike current to be shunted through the ESD protection diodes. At the same time, the voltage drop across both series element acts to lower the clamping voltage at the protected device terminal. Through this arrangement, the inductive elements also tune the impedance of the ESD protection element by cancelling the capacitive load presented by the ESD diodes to the signal line. This improves the signal integrity and makes the overall ESD protection device more transparent to the high bandwidth data signals passing through the channel. The innovative PicoGuard XS architecture turns the disadvantages of the parasitic inductive elements into useful components that help to limit the ESD current strike to the protected device and also improves the signal integrity of the system by balancing the capacitive loading effects of the ESD diodes. At the same time, this architecture provides an impedance matched signal path for 50Ω loading applications. Board designs can take advantage of precision internal component matching for improved signal integrity, which is not otherwise possible with discrete components at the system level. This helps to simplify the PCB layout considerations by the system designer and eliminates the associated passive components for load matching that is normally required with standard ESD protection circuits. Each ESD channel consists of a pair of diodes in series which steer the positive or negative ESD current pulse to either the Zener diode or to ground. This embedded Zener diode also serves to eliminate the need for a separate bypass capacitor to absorb positive ESD strikes to ground. The CM1236 protects against ESD pulses up to ±8kv contact per the IEC 61000-4-2 standard. |
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