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CM1230-J2CP Datasheet(PDF) 11 Page - ON Semiconductor |
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CM1230-J2CP Datasheet(HTML) 11 Page - ON Semiconductor |
11 / 16 page CM1230 Rev. 3 | Page 11 of 16 | www.onsemi.com Mechanical Details (cont’d) CSP-4 Mechanical Specifications (CM1230-J2CP) The CM1230-J2CP is supplied in a 4 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 4 Millimeters Inches Dim Min Nom Max Min Nom Max A1 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 0.915 0.960 1.005 0.0360 0.0378 0.0396 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces Controlling dimension: millimeters Package Dimensions for CM1230-J2CP Chip Scale Package |
Similar Part No. - CM1230-J2CP |
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Similar Description - CM1230-J2CP |
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