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BFC237011125 Datasheet(PDF) 13 Page - Vishay Siliconix

Part No. BFC237011125
Description  DC Film Capacitors MKT Radial Potted Type
Download  18 Pages
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Maker  VISHAY [Vishay Siliconix]
Homepage  http://www.vishay.com
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BFC237011125 Datasheet(HTML) 13 Page - Vishay Siliconix

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Document Number: 28108
For technical questions, contact: dc-film@vishay.com
www.vishay.com
Revision: 04-Aug-09
89
MKT 370
DC Film Capacitors
MKT Radial Potted Type
Vishay BCcomponents
HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY THICKNESS IN mW/°C
POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of
the free ambient temperature.
The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film
Capacitors”.
The component temperature rise (
ΔT) can be measured (see section “Measuring the component temperature” for more details)
or calculated by
ΔT = P/G:
• ΔT = Component temperature rise (°C)
• P = Power dissipation of the component (mW)
• G = Heat conductivity of the component (mW/°C)
MEASURING THE COMPONENT TEMPERATURE
A thermocouple must be attached to the capacitor body as in:
The temperature is measured in unloaded (Tamb) and maximum loaded condition (TC).
The temperature rise is given by
ΔT = T
C - Tamb.
To avoid radiation or convection, the capacitor should be tested in a wind-free box.
Maximum allowed component temperature rise (
ΔT)
as a function of the ambient temperature (Tamb) for voltage 63 V
Maximum allowed component temperature rise (
ΔT)
as a function of the ambient temperature (Tamb) for voltages > 63 V
Wmax.
(mm)
HEAT CONDUCTIVITY (mW/°C)
PITCH 5 mm
2.5
2.5
3.5
3.0
4.5
4.0
6.0
5.5
- 60
- 20
20
60
100
T
amb (°C)
16
12
8
4
0
- 60
- 20
20
60
100
T
amb (°C)
16
12
8
4
0
Thermocouple


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