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BFC237011823 Datasheet(PDF) 13 Page - Vishay Siliconix |
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BFC237011823 Datasheet(HTML) 13 Page - Vishay Siliconix |
13 / 18 page Document Number: 28108 For technical questions, contact: dc-film@vishay.com www.vishay.com Revision: 04-Aug-09 89 MKT 370 DC Film Capacitors MKT Radial Potted Type Vishay BCcomponents HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY THICKNESS IN mW/°C POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of the free ambient temperature. The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film Capacitors”. The component temperature rise ( ΔT) can be measured (see section “Measuring the component temperature” for more details) or calculated by ΔT = P/G: • ΔT = Component temperature rise (°C) • P = Power dissipation of the component (mW) • G = Heat conductivity of the component (mW/°C) MEASURING THE COMPONENT TEMPERATURE A thermocouple must be attached to the capacitor body as in: The temperature is measured in unloaded (Tamb) and maximum loaded condition (TC). The temperature rise is given by ΔT = T C - Tamb. To avoid radiation or convection, the capacitor should be tested in a wind-free box. Maximum allowed component temperature rise ( ΔT) as a function of the ambient temperature (Tamb) for voltage 63 V Maximum allowed component temperature rise ( ΔT) as a function of the ambient temperature (Tamb) for voltages > 63 V Wmax. (mm) HEAT CONDUCTIVITY (mW/°C) PITCH 5 mm 2.5 2.5 3.5 3.0 4.5 4.0 6.0 5.5 - 60 - 20 20 60 100 T amb (°C) 16 12 8 4 0 - 60 - 20 20 60 100 T amb (°C) 16 12 8 4 0 Thermocouple |
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