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SN74AUC2G241DCTR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74AUC2G241DCTR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 15 page www.ti.com FEATURES Seemechanicaldrawingsfordimensions. DCTPACKAGE (TOP VIEW) DCUPACKAGE (TOP VIEW) YZP PACKAGE (BOTTOMVIEW) 1 V CC 8 1OE 2 7 1A 2OE 3 6 2Y 1Y 4 5 GND 2A 3 6 1Y 2Y 8 1 V CC 1OE 5 GND 4 2A 2 7 2OE 1A GND 5 4 2A 3 6 1Y 2Y 2 7 2OE 1A 8 V CC 1 1OE DESCRIPTION/ORDERING INFORMATION SN74AUC2G241 DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCES535C – DECEMBER 2003 – REVISED JANUARY 2007 • Available in the Texas Instruments • Low Power Consumption, 10 µA at 1.8 V NanoFree™ Package • ±8-mA Output Drive at 1.8 V • Optimized for 1.8-V Operation and Is 3.6-V I/O • Latch-Up Performance Exceeds 100 mA Per Tolerant to Support Mixed-Mode Signal JESD 78, Class II Operation • ESD Protection Exceeds JESD 22 • I off Supports Partial-Power-Down Mode – 2000-V Human-Body Model (A114-A) Operation – 200-V Machine Model (A115-A) • Sub-1-V Operable – 1000-V Charged-Device Model (C101) • Max t pd of 1.9 ns at 1.8 V This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The SN74AUC2G241 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The device is organized as two 1-bit line drivers with separate output-enable (1OE, 2OE) inputs. When 1OE is low or 2OE is high, the device passes data from the A inputs to the Y outputs. When 1OE is high or 2OE is low, the outputs are in the high-impedance state. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74AUC2G241YZPR _ _ _U2_ 0.23-mm Large Bump – YZP (Pb-free) –40°C to 85°C SSOP – DCT Reel of 3000 SN74AUC2G241DCTR U41_ _ _ VSSOP – DCU Reel of 3000 SN74AUC2G241DCUR U2_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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