Test & Burn-In

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

Test & Burn-In

100V AC for 1 minute

100m

max. at 10mA/20mV max.

–40°C to +150°C / -55°C to +150°C

W

Features

Insulation Resistance:

Dielectric Withstanding Voltage:

Contact Resistance:

Operating Temperature Range:

1,000M

min. at 100V DC

W

Housing:

Contacts:

Plating:

Polyetherimide (PEI), glass-filled

Polyethersulphone (PES), glass-filled

Beryllium Copper (BeCu)

Gold over Nickel

Materials and Finish

Secure package alignment due to self contacting structure

without upper pressing force (ZIF)

Contacting structure to nip the sides of solder balls to lower

damages of coplanarity of solder balls

í Open top type sockets with "Tweezer Style Contacts"

For FBGA packages

í

í

Contact Force:

Mating Cycles:

15g per pin approx.

10,000 insertions minimun

Specifications

Part Number (Details)

Series No.

No. of Contact Pins

Design Number

Mark for Positioning Pins

Contact Terminal Lengths and Form

NP352

560

09

*

*

--

-

Outline Base Socket Dimensions

D-36

Since the solder balls are touched

by two contacts on each side,

the solder ball damage can be

minimized; additional features

are low actuation force and

compact socket size

IC

Ball

Socket

Base A

Contacts

Socket

Base B

Yamaichi's 2-point Tweezer Contact