SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

Test & Burn-In

Outline Socket Dimensions

IC176 Series

Housing:

Contacts:

Plating:

Polyethersulphone (PES), Polyetherimide (PEI)

Beryllium Copper (BeCu)

Gold over Nickel

Insulation Resistance:

Dielectric Withstanding Voltage:

Contact Resistance:

Current Rating:

Operating Temperature Range:

Mating Cycles:

1,000M

min. at 500V DC

700V AC for 1 minute

30m

max. at 10mA/20mV max.

1A max.

–40°C to +150°C

10,000 insertions min.

W

W

Materials and Finish

Features

Series No.

MF = Flanged

Unmarked = Not Flanged

Design Number

IC-176

4MF

--

í

í

í

Card thickness 1.27mm

Kelvin type contact which utiIizes both sides of the contact system

Easy insertion and extraction by latch

Pin Count

A

Pitch

IC-176-2-**

1.27

72

125.0

15.0

30.0

30.0

30.0

30.0

30.0

IC-176-4-**

2.54

30

100.0

9.0

IC-176-6-**

2.54

35

115.0

9.0

IC-176-8-**

1.27

64

115.0

15.0

IC-176-10-**

1.27

100

161.4

17.0

Part Number

Pitch

A

B

C

Matching IC Dimensions

Recommended PC Board Layout

IC-176-2-**

Top View from Socket

134.0

6.35

1.27 x 35 = 44.45

1.27

2-

3.2

Æ

144-

0.8

Æ

1.27 x 35 = 44.45

44.45

1.27

R- 1.57

2.03

44.45

6.35

1.04

1.8 min

Æ3.18

Component area

107.95

101.19

1.27

9.14

Specifications