SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

Test & Burn-In

ý

Æ3.2

0.5 x 0.46

125.0

116.0

0.7

1.78

1.78 x 55 = 97.9

1.78 x 23 = 40.94

1.78 x 23 = 40.94

1.78 x 7 = 12.46

102.0

Housing:

Contacts:

Plating:

Polysulphone (PSF), glass-filled - UL94V-0

Beryllium Copper (BeCu)

Gold (0.3µm min.) over Nickel (2.5 to 4.5µm min.)

Series No.

Contact Plating (G = Gold Plating)

Straight, Through Hole Type

Design Number

MF = Flanged

Unmarked = Not Flanged

No. of Contact Pins

IC70

30 11 MF

-- G4

Insulation Resistance:

Dielectric Withstanding Voltage:

Contact Resistance:

Current Rating:

Operating Temperature Range:

Mating Cycles:

í

í

Dual wipe contacts ensure high reliability

Low costs due to selective gold plating

1,000M

min. at 500V DC

700V AC for 1 minute

30m

max. at 10mA/20mV max.

1A max.

–40°C to +150°C

10,000 insertions min.

W

W

Materials and Finish

A

B

C

D

E

2-

3.5

Æ

0.8

0.5 x 0.46

ý

May be cut at points marked by

into 3 separate sections

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Features

13.36

7

26.6

19.6

12.6

1.27 x 6 =

7.62

1.27

12

41.0

34.0

27.0

2.00 x 11 = 22.00

2.0

15

36.8

29.8

22.8

1.27 x 14 = 17.78

1.27

20

47.5

40.5

33.5

1.50 x 19 = 28.50

1.5

23

44.0

38.0

32.0

1.27 x 22 = 27.94

1.27

24

63.0

57.0

51.0

2.00 x 23 = 46.00

2.0

30

77.0

67.0

57.0

1.80 x 29 = 52.20

1.8

30

57.0

49.0

41.0

1.27 x 29 = 36.83

1.27

30

62.5

55.5

48.5

1.50 x 29 = 43.50

1.5

40

94.0

84.0

74.0

1.778 x 55 = 69.342

1.778

56

125.0

116.0

102.0

1.78 x 55 = 97.90

1.78

IC70-0726**-G4

IC70-1217**-G4

IC70-1521**-G4

IC70-2020**-G4

IC70-2313**-G4

IC70-2418**-G4

IC70-3011**-G4

IC70-3015**-G4

IC70-3019**-G4

IC70-4014**-G4

Outline Socket Dimensions

IC70 Series

Part Number

Pin Count

A

B

C

D

E

B

D

E

2-

3.5

Æ

Recommended PC Board Layout

Top View from Socket

Specifications

Part Number (Details)