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NVS0.7EG-M6 Datasheet(PDF) 8 Page - Power-One |
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NVS0.7EG-M6 Datasheet(HTML) 8 Page - Power-One |
8 / 11 page Product Specifications NV Series: 4 - 6W DC/DC Converters Oct 2001 9-36V, 18-36V, 36-72V & 16-75V Inputs 3.3V, 5.0V, 12V, 15V, ±5.0V, ±12V, ±15V & ±24V Outputs 18-Oct-01 Rev 1.0 Page 8 of 11 www.power-one.com Surface Mount Assembly Soldering: The following instructions must be observed when soldering the unit. Failure to observe these instructions may result in failure or significant degradation of the module performance. Power- One will not honor any warranty claims arising from failure to observe these instructions. This product is approved for forced convection reflow soldering only. The curves below define the maximum peak reflow temperature permissible measured on Pins 1 and 10 of the converter. The lead-frame is constructed for a high temperature glass filled, UL94V0 flame retardant, diallyl ortho-phthalate moulding com pound commonly used for packaging of electronics components. It has passed NASA outgassing tests and is certified to MIL-M-14. The coefficient of thermal expansion is equivalent to FR4. The gull wing leads are formed to ensure optimal solder joint strength and structure. Furthermore they facilitate optical inspection (manual or automatic). The leads are formed from a 97% Cu alloy plated with Cu and Sn 90. This material is commonly used in the manufacture of integrated circuits. It has good corrosion resistance and exhibits the nobility inherent to all high copper alloys. Unlike brasses, this material is essentially immune to stress corrosion cracking. It also exhibits excellent solderability. It is readily wetted by solders and performs well in standard solderability tests. (Dip of Class II or better). The product is manufactured with a patented process, which is fully automated, and ‘in-line’. This ensures that there is no contamination or mechanical stress on the lead-frame so that the co planarity and solderability are maintained. The product is shipped in JEDEC trays to guarantee preservation of the co-planarity and enable fully automated assembly in the final application. . Pick & Place Assembly: The product is designed with a large flat area in the center of the top surface to serve as a pick up point for automated vacuum pick and place equipment. The ‘open board’ construction of the unit ensures that weight is kept to a minimum. However due to the relatively large size of the component, a large nozzle (> 2.0mm, depending on vacuum pressure) is recommended for picking and placing. The unit may also be automatically handled using ‘odd-form’ placement equipment, with mechanical grippers. For this type of equipment the end edges of the device, which have no leads and also feature the greatest dimensional accuracy, should be used as pick-up points. Restriction curve above 215ºC Peak temp. at pins 1 and 10 (ºC) 200 205 210 215 220 225 230 235 240 245 10 20 30 40 50 60 tp (s) Time (s) 0 50 100 150 200 250 300 Max. temp. on pins 1 and 10 during reflow soldering (deg C) tp Peak Temperature (See fig below) 190 – 450 s |
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