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IC37NRB-2003-G4 Datasheet(PDF) 1 Page - Yamaichi Electronics Co., Ltd. |
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IC37NRB-2003-G4 Datasheet(HTML) 1 Page - Yamaichi Electronics Co., Ltd. |
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1 / 1 page SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test & Burn-In Dual Inline Package (DIP) IC37 Series 10.3 19.5 2.9 8.0 13.9 14 14 16 18 20 20 22 22 24 24 24 28 28 28 32 32 32 40 42 48 20.04 20.04 22.58 25.12 27.66 27.66 30.20 30.20 32.74 32.74 32.74 37.82 37.82 37.82 42.90 42.90 42.90 53.06 55.60 63.22 7.8 10.3 7.8 7.8 7.8 7.8 7.8 10.3 10.3 10.3 15.4 7.8 15.4 10.3 7.8 15.4 15.4 15.4 15.4 17.0 19.5 17.0 17.0 17.0 17.0 17.0 19.5 19.5 19.5 24.6 17.0 24.6 19.5 17.0 24.6 24.6 24.6 24.6 2.54 x 6 = 15.24 2.54 x 6 = 15.24 2.54 x 7 = 17.78 2.54 x 8 = 20.32 2.54 x 9 = 22.86 2.54 x 9 = 22.86 25.4 x 10 = 25.40 2.54 x 10 = 25.40 2.54 x 11 = 27.94 2.54 x 11 = 27.94 2.54 x 11 = 27.94 2.54 x 13 = 33.02 2.54 x 13 = 33.02 2.54 x 13 = 33.02 2.54 x 15 = 38.10 2.54 x 15 = 38.10 2.54 x 15 = 38.10 2.54 x 19 = 48.26 2.54 x 20 = 50.80 2.54 x 23 = 58.42 2.0 2.9 2.0 2.0 2.0 2.0 2.0 2.9 2.9 2.9 8.0 2.0 8.0 2.9 2.0 8.0 8.0 8.0 8.0 7.5 8.0 7.5 7.5 7.5 7.5 7.5 8.0 8.0 8.0 10.3 7.5 10.3 8.0 7.5 10.3 10.3 10.3 10.3 11.4 13.9 11.4 11.4 11.4 11.4 11.4 13.9 13.9 13.9 19.0 11.4 19.0 13.9 11.4 19.0 19.0 19.0 19.0 – – – – – – – – – – 6.21 6.21 – – – 8.75 – 13.83 15.10 16.37 – – – – – – – – – – 20.32 – – 25.40 – 25.40 – 25.40 25.40 30.48 IC37NRB-1403-G4 IC37NRB-1404-G4 IC37NRB-1603-G4 IC37N B-1803-G4 R IC37N B-2003-G4 R IC37N B-2004-G4 R IC37N B-2203-G4 R IC37N B-2204-G4 R IC37N B-2403-G4 R IC37N B-2404-G4 R IC37N B-2406-G4 R IC37N B-2803-G4 R IC37N B-2804-G4 R IC37N B-2806-G4 R IC37N B-3203-G4 R IC37N B-3206-G4 R IC37N B-3204-G4 R IC37N B-4006-G4 R IC37N B-4206-G4 R IC37N B-4806-G4 R Housing: Contacts: Plating: Polyphenylenesulfide (PPS), glass filled Beryllium Copper (BeCu) Gold over Nickel Series No. Contact Plating: B= Mating Ter. Solder Ter. 0.3µm Au 0.1µm Au Row Space (03 = 0.3 inches) Straight, Through Hole Type No. of Contact Pins Gold Plating Housing Material R =PPS IC37N R B14 03 -- G4 Operating Temperature Range: Mating Cycles: í í í í Dual wipe contacts ensure high reliability Low costs due to selective gold plating Applicable for IC packages and side braze packages Ideal for automated burn-in 1,000M min. at 500V DC 700V AC for 1 minute 20m max. at 10mA /20mV max. 1A max. 25,000 to 50,000 insertions W W –40°C to +170°C (PPS) Materials and Finish B±0.1 J±0.1 2- 3.2 Æ Pin Count Æ0.9 B±0.05 A J±0.2 H 2.54±0.1 2.54±0.05 2.4 1.8 2- 3.2 Æ 1.5 +0.1 0 4.0 3.2 0.5 ±0.1 Features Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Part Number Pin Count A D B E F G HJ C Specifications Outline Socket Dimensions Recommended PC Board Layout Top View from Socket Part Number (Details) |
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