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CDCM61001 Datasheet(PDF) 4 Page - Texas Instruments |
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CDCM61001 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 35 page CDCM61001 SCAS869C – FEBRUARY 2009 – REVISED FEBRUARY 2010 www.ti.com RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range (unless otherwise noted). PARAMETER MIN NOM MAX UNIT VCC_OUT Output supply voltage 3.0 3.30 3.60 V VCC_PLL1 PLL supply voltage 3.0 3.30 3.60 V VCC_PLL2 PLL supply voltage 3.0 3.30 3.60 V VCC_VCO On-chip VCO supply voltage 3.0 3.30 3.60 V VCC_IN Input supply voltage 3.0 3.30 3.60 V TA Ambient temperature –40 +85 °C DISSIPATION RATINGS (1) (2) VALUE TEST 4 × 4 VIAS PARAMETER CONDITIONS ON PAD UNIT qJA Thermal resistance, junction-to-ambient 0 LFM 35 °C/W qJP (3) Thermal resistance, junction-to-pad 4 °C/W (1) The package thermal resistance is calculated in accordance with JESD 51 and JEDEC 2S2P (high-K board). (2) Connected to GND with nine thermal vias (0.3-mm diameter). (3) qJP (junction-to-pad) is used for the QFN package, because the primary heat flow is from the junction to the GND pad of the QFN package. 4 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): CDCM61001 |
Similar Part No. - CDCM61001_10 |
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Similar Description - CDCM61001_10 |
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