Data

Data

A1

B1

OE

1.8 V

System

Controller

3.3 V

System

3.3 V

1.8 V

A2

B2

0.1 mF

0.1 mF

1 mF

TXS0102

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

Reel of 3000

TXS0102YZPR

2H_

0.23-mm Large Bump – YZP

Reel of 3000

TXS0102DCTR

NFE_ _ _

–40°C to 85°C

SSOP – DCT

Tube of 250

TXS0102DCTT

NFE _ _ _

VSSOP – DCU

Reel of 3000

TXS0102DCUR

NFE_

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

DCT: The actual top-side marking has three additional characters that designate the year, month, and wafer fab/assembly site.

DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

PIN DESCRIPTION

NO.

NAME

TYPE

FUNCTION

DCT,

YZP

DCU

1

A1

B2

I/O

2

B1

GND

GND

Ground

3

C1

PWR

A-port supply voltage. 1.65 V

4

D1

A2

I/O

5

D2

A1

I/O

Output enable (active High). Pull OE low to place all outputs in 3-state mode.

6

C2

OE

Input

7

B2

PWR

B-port supply voltage. 2.3 V

8

A2

B1

I/O

TYPICAL OPERATING CIRCUIT

2

Submit Documentation Feedback

Copyright © 2007–2009, Texas Instruments Incorporated

Product Folder Link(s): TXS0102