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TYN256P Datasheet(PDF) 9 Page - Power Integrations, Inc.

Part No. TYN256P
Description  Energy Efficient, Low Power Off-line Switcher
Download  20 Pages
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Maker  POWERINT [Power Integrations, Inc.]
Homepage  http://www.powerint.com
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TYN256P Datasheet(HTML) 9 Page - Power Integrations, Inc.

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TNY256
9
BYPASS Voltage .......................................... -0.3 V to 9 V
Storage Temperature ..................................... -65 to 125
°C
Operating Junction Temperature(2) ................ -40 to 150
°C
Lead Temperature(3) ................................................ 260
°C
3. 1/16" from case for 5 seconds.
ABSOLUTE MAXIMUM RATINGS(1)
DRAIN Voltage ....................................... - 0.3 V to 700 V
Peak DRAIN Current ............................................. 800 mA
EN/UV Voltage ............................................ - 0.3 V to 9 V
EN/UV Current ...................................................... 100 mA
1. All voltages referenced to SOURCE, T
A = 25 °C.
2. Normally limited by internal circuitry.
S1 Open
See Note 1
I
EN/UV = -25 µA
I
EN/UV = 25 µA
V
EN/UV = 0 V
(MOSFET Not Switching)
See Note 2
-68
-50
-28
-15
-10
-5
1.10
1.45
1.80
-58
-35
215
CONTROL FUNCTIONS
Output
Frequency
Maximum
Duty Cycle
EN/UV Pin Turnoff
Threshold Current
EN/UV Pin
Hysteresis Current
EN/UV Pin
Voltage
EN/UV Short-
Circuit Current
DRAIN
Supply Current
BYPASS Pin
Charge Current
kHz
%
µA
µA
V
µA
µA
µA
mA
mA
Min
Typ
Max
f
OSC
DC
MAX
I
DIS
I
HYS
V
EN
I
ENSC
I
S1
I
S2
I
CH1
I
CH2
Parameter
Symbol
(Unless Otherwise Specified)
See Figure 14
Conditions
130
255
-5.50
-4.10
EN/UV Open
(MOSFET Switching)
See Note 2, 3
T
j = 25 °C
See Figure 4
Units
SOURCE = 0 V
; T
j = -40 to 125 °C
66
T
j = -40 °C to 125 °C
T
j = 125 °C
-52
V
EN/UV = 0 V, Tj = -40 °C to 125 °C
V
EN/UV = 0 V, Tj = 125 °C
-45
V
BP = 0 V, Tj = 25 °C
See Note 4,5
V
BP = 4 V, Tj = 25 °C
See Note 4,5
170
2.70
-40
5.0
Average
Peak-Peak Jitter
115
140
63
69
3.8
6.2
-68
-41
1.85
3.25
-58
-25
300
-3.75
-7.50
-6.00
-2.25
Thermal Impedance: Y Package (
θ
JA)
(1) ............... 70
°C/W
(
θ
JC)
(2) ................. 2
°C/W
P/G Package:
(
θ
JA) ........ 45 °C/W
(3); 35
°C/W(4)
(
θ
JC)
(2) ............................ 5
°C/W
1. Free standing with no heatsink.
2. Measured at tab closest to plastic interface or source pin.
3. Soldered to 0.36 sq. inch (232mm2), 2oz (610 gm/m2) copper
clad.
4. Soldered to 1 sq. inch (645mm2), 2oz. (610 gm/m2) copper clad
THERMAL IMPEDANCE


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