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DVA16XP282 Datasheet(PDF) 2 Page - Microchip Technology |
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DVA16XP282 Datasheet(HTML) 2 Page - Microchip Technology |
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2 / 18 page  MPLAB® ICE 2000 DS51140M-page 2 © 2006 Microchip Technology Inc. 2.4 Flex Circuit Cable Once the processor module is inserted into the emulator pod, the flex circuit cable extends the emulator system to the target application. This is a custom cable that is attached inside the processor module enclosure, and can be replaced in the field by removing the end cap of the processor module enclosure. Please, DO NOT PULL on the flex circuit cable to remove the processor module from the pod. Use the fins of the processor module end cap to leverage the module from the pod. Emulator analog functions may not operate within the performance specifications published in the device data sheet due to parasitic capacitance (up to 120 pf) of the flex cable. 2.5 Device Adapter The device adapter provides a common interface for the device being emulated. It is provided in standard DIP and PLCC styles. The adapter also contains a spe- cial device that provides an oscillator clock to accu- rately emulate the oscillator characteristics of the PICmicro MCU. Due to components on the device adapter, which require target power, the device adapter should be removed from the flex circuit cable (see Figure 2-1) when emulator power is being used and the processor module is not connected to the target. This will eliminate any loading effects on I/O pins. 2.6 Transition Socket Transition Sockets are available in various styles to allow a common device adapter to be connected to one of the supported surface mount package styles. Transi- tion sockets are available for various pin counts and pitches for SOIC, QFP and other styles. For more infor- mation on transition sockets, see the “MPLAB® ICE 2000/4000 Transition Socket Specification” (DS51194). An emulator system consists of the following components which can be ordered separately: • An emulator pod (including the host-to-pod cable and power supply) • A processor module (including the flex circuit cable) • A device adapter • An optional transition socket (for surface mount emulation) 3.0 EMULATOR-RELATED ISSUES General limitations that apply to the MPLAB ICE 2000 emulator may be found in the on-line help. Select Help>Topics and then select “MPLAB ICE 2000” under “Debuggers”. Device-specific limitations can be found as above or by selecting Debugger>Settings, clicking the Limitations tab, and then clicking the Details button. 4.0 PROCESSOR MODULES Processor modules are identified on the top of the assembly (e.g., PCM18XA0). To determine which processors are supported by a specific module, refer to the file “Readme for MPLAB ICE 2000.txt” in the MPLAB IDE installation directory or the latest “Product Selector Guide” (DS00148), which can be found on the Microchip web site at www.microchip.com. A typical processor module contains a special bond-out version of a PICmicro MCU, with device buffers to control data flow and control logic. It provides the means of configuring the MPLAB ICE 2000 emulator for a specific PICmicro MCU family and handles low-voltage emulation when needed. 4.1 Power The operating voltage for most of the control logic and buffering on the processor module is +5V and is supplied by the emulator pod. Power to the emulator processor and some of its surrounding buffers is user- selectable, and can be powered by the emulator pod (at +5V only) or the target application system (from 2.0V to 5.5V). This is software selectable and is configurable through the MPLAB® IDE software. At no time will the emulator system directly power the target application system. ALWAYS insert the processor module into the emulator pod before applying power to the pod. When connecting to a target application system, there may be a voltage level on the target application even though power has not yet been applied to the target application circuit. This is normal, and is due to current leakage through VCC of the device adapter. The current leakage will typically be less than 20 mA. However, if the target application is using a voltage regulator, it should be noted that some regulators require the use of an external shunt diode between VIN and VOUT for reverse-bias protection. Refer to the manufacturer’s data sheets for additional information. Note: When removing the processor module, DO NOT PULL on the flex cable. Use the tabs on the processor module or damage to the flex cable may occur. |
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