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TDA8932B Datasheet(PDF) 16 Page - NXP Semiconductors

Part No. TDA8932B
Description  Class-D audio amplifier
Download  48 Pages
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Maker  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
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TDA8932B Datasheet(HTML) 16 Page - NXP Semiconductors

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TDA8932B_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 18 December 2008
16 of 48
NXP Semiconductors
TDA8932B
Class-D audio amplifier
10. Limiting values
[1]
VP = VDDP1 − VSSP1 = VDDP2 − VSSP2.
[2]
Measured with respect to pin INREF; Vx < VDD + 0.3 V.
[3]
Measured with respect to pin VSSD(HW); Vx < VDD + 0.3 V.
[4]
Measured with respect to pin CGND; Vx < VDD + 0.3 V.
[5]
VSS = VSSP1 = VSSP2; VDD = VDDP1 = VDDP2.
[6]
Current limiting concept.
[7]
Human Body Model (HBM); Rs = 1500 Ω; C = 100 pF
For pins 2, 3, 11, 14 and 15 Vesd = ±1800 V.
[8]
Machine Model (MM); Rs =0 Ω; C = 200 pF; L = 0.75 µH.
11. Thermal characteristics
Table 8.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VP
supply voltage
asymmetrical supply
[1]
−0.3
+40
V
Vx
voltage on pin x
IN1P, IN1N, IN2P, IN2N
[2]
−5+5
V
OSCREF, OSCIO, TEST
[3] VSSD(HW) − 0.3 5
V
POWERUP, ENGAGE,
DIAG
[4]
VCGND − 0.3
6
V
all other pins
[5] VSS − 0.3
VDD + 0.3 V
IORM
repetitive peak output
current
maximum output
current limiting
[6] 4-
A
Tj
junction temperature
-
150
°C
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
P
power dissipation
-
5
W
Vesd
electrostatic discharge
voltage
HBM
[7]
−2000
+2000
V
MM
[8]
−200
+200
V
Table 9.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
SO32 package
Rth(j-a)
thermal resistance from junction
to ambient
free air natural convection
JEDEC test board
[1] -
41
44
K/W
2 layer application board
[2] -
44
-
K/W
Ψj-lead
thermal characterization
parameter from junction to lead
-
-
30
K/W
Ψj-top
thermal characterization
parameter from junction to top of
package
[3] -
-
8
K/W


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