RB520S30_1

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 01 — 6 October 2009

4 of 12

NXP Semiconductors

RB520S30

FR4 PCB, standard footprint

Fig 1.

Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Fig 2.

Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

006aab700

10

1

10

(K/W)

1

duty cycle =

1

0.75

0.5

0.33

0.2

0.25

0.1

0.05

0.02

0.01

0

006aab701

10

1

10

(K/W)

1

duty cycle =

1

0.75

0.5

0.33

0.2

0.25

0.1

0.05

0.02

0.01

0