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DF2450DP-0.9C Datasheet(PDF) 7 Page - Hirose Electric

Part # DF2450DP-0.9C
Description  0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
Download  8 Pages
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Manufacturer  HIROSE [Hirose Electric]
Direct Link  http://www.hirose-connectors.com
Logo HIROSE - Hirose Electric

DF2450DP-0.9C Datasheet(HTML) 7 Page - Hirose Electric

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B303
DF24 Series
0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
■Usage recommendations and Precautions
1. Recommended
temperature profile
(Including Lead-free solder)
2.Recommended manual soldering
3.Recommended screen thickness and
opening area ratio (Pattern area ratio)
4. Board warpage
5. Cleaning conditions
6. Wire preparation and
contact crimping
7. Precautions
Manual soldering: 300±10ç for 3 seconds
Thickness: 0.12mm
Opening area ratio: 80%
Maximum of 0.03mm at the connector center, with both ends of the connector as reference points.
Refer to “Nylon Connector Use Handbook”.
Refer to “Nylon Connector Use Handbook”.
The crimp contacts are of a very small form and because of this, crimping should be performed carefully
based on the content of the Crimping Conditions Table and the Crimping Quality Standards Manual.
■Removal of the inserted socket contacts
* Using the socket contact extraction tool (DF-C-PO(B) ) carefully lift the contact retention tab on the
insulator housing, as shown on the Fig.1 and pull-out the wire.
* Lift the tab ONLY enough to remove the contact. Exercise caution NOT to deflect too much.
* The tab should return to its original position after the contact is removed.
* The tab must be in its original position before inserting the new socket contact.
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, providing that
there is a return to normal temperature between the first and second cycle.
Note 2: The temperature profile indicates the board surface at the point of contacts with the
connector terminals.
250
240
220
190
170
Temperature(ç)
Time(S)
Preheating
Soldering
200
150
100
50
0
50
100
150
200
250
Fig. 1. Contact Removal
Contact extraction tool
DF-C-PO(B)
Contact
retention tab
Reflow conditions
Preheating:
180±10ç 60~20sec.
Soldering:
250ç max.
240çmin. 20sec. max.
220çmin. 60sec. max.
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.


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