Electronic Components Datasheet Search |
|
DF24A50DP-0.9C Datasheet(PDF) 8 Page - Hirose Electric |
|
DF24A50DP-0.9C Datasheet(HTML) 8 Page - Hirose Electric |
8 / 8 page DF24 Series ●0.9 mm Pitch Vertical Mating Board-to-Wire Connectors B304 7. Precautions ■Connector Mating/Un-mating * Hold the socket at both ends (as illustrated on Fig.2) when mating or un-mating. The mating/un- mating of the connectors must be within the indicated angle of 20° on both axis. ■Bundling of the Wires * To avoid wire damage or termination faults bundling of the wires should be at the distance of 20 mm min. from the socket (Fig. 3-1) * When bundling at the distance less than the recommended 20 mm, it is critical to avoid sharp bend radius (Fig. 3-2) or apply stretching or twisting forces (Fig. 3-3) * Do not mate/un-mate connectors when not mounted on the board. * Do not use connector as the only support for the board. * Do not use flux compounds when hand soldering. * Slight color shade difference of the insulator bodies will not affect the form, fit or function of the connectors. Bundling close to socket Do not stretch or twist Sharp bend Fig. 3-2 Fig. 3-3 Fig. 3-1 Fig. 3. Bundling requirements Hold here 20° 20° DO NOT MATE / UN-MATE HOLDING BY THE WIRES. Fig. 2. Mating / Un-mating The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. |
Similar Part No. - DF24A50DP-0.9C |
|