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1210L200SLYR Datasheet(PDF) 3 Page - Littelfuse |
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1210L200SLYR Datasheet(HTML) 3 Page - Littelfuse |
3 / 4 page 11 Revised: June 4, 2010 POLYFUSE® Resettable PTCs © 2010 Littelfuse, Inc Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/LoRho.html for current information. Surface Mount > Lo Rho Series Lo Rho Series Soldering Parameters Profile Feature Pb-Free Assembly Average Ramp-Up Rate (T S(max) to TP) 3°C/second max Pre Heat: Temperature Min (T s(min)) 150°C Temperature Max (T s(max)) 200°C Time (Min to Max) (t s) 60 – 180 secs Time Maintained Above: Temperature (T L) 217°C Temperature (t L) 60 – 150 seconds Peak / Classification Temperature (T P) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T P) 8 minutes Max. -- All temperature refer to topside of the package, measured on the package body surface -- If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N 2 environment for lead -- Recommended maximum paste thickness is 0.25mm (0.010 inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices Dimensions Part Number Device Dimension Solder Pad Layout AB C D E F G H mm mm mm mm mm mm mm mm Min Max Min Max Min Max Min Max Min Max 0805L075SLYR 2.00 2.20 1.20 1.50 0.40 0.75 0.20 0.55 0.05 0.45 1.00 1.20 1.50 0805L110SLYR 2.00 2.20 1.20 1.50 0.40 0.75 0.20 0.55 0.10 0.45 1.00 1.20 1.50 1206L110SLYR 3.00 3.40 1.50 1.80 0.40 0.75 0.25 0.75 0.10 0.45 1.00 1.80 1.80 1206L150SLYR 3.00 3.40 1.50 1.80 0.40 0.70 0.25 0.75 0.10 0.45 1.00 1.80 1.80 1210L200SLYR 3.00 3.43 2.35 2.80 0.40 0.70 0.25 0.75 0.20 0.50 1.00 2.00 2.50 1210L350SL-SYR 3.00 3.43 2.35 2.80 0.60 1.00 0.25 0.75 0.20 0.50 1.00 2.00 2.50 1812L190SLPR 4.37 4.73 3.07 3.41 0.40 0.70 0.30 1.20 0.25 0.65 1.78 3.45 3.15 C Top View Side View Bottom View D Marking code varies by device -- See Electrical Characteristics table E A B FF Solder Pad Layout Device Dimensions H G |
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