11

Revised: June 4, 2010

© 2010 Littelfuse, Inc

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/LoRho.html for current information.

Surface Mount > Lo Rho Series

Lo Rho Series

Soldering Parameters

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (T

3°C/second max

Pre Heat:

Temperature Min (T

150°C

Temperature Max (T

200°C

Time (Min to Max) (t

60 – 180 secs

Time Maintained

Above:

Temperature (T

217°C

Temperature (t

60 – 150 seconds

Peak / Classification Temperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

-- All temperature refer to topside of the package, measured on the package body surface

-- If reflow temperature exceeds the recommended profile, devices may not meet the

performance requirements

-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N

2

environment for lead

-- Recommended maximum paste thickness is 0.25mm (0.010 inch)

-- Devices can be cleaned using standard industry methods and solvents

-- Devices can be reworked using the standard industry practices

Dimensions

Part Number

Device Dimension

Solder Pad Layout

AB

C

D

E

F

G

H

mm

mm

mm

mm

mm

mm

mm

mm

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

0805L075SLYR

2.00 2.20 1.20

1.50 0.40 0.75 0.20

0.55

0.05

0.45

1.00

1.20

1.50

0805L110SLYR

2.00 2.20 1.20

1.50 0.40 0.75 0.20

0.55

0.10

0.45

1.00

1.20

1.50

1206L110SLYR

3.00 3.40 1.50

1.80 0.40 0.75 0.25

0.75

0.10

0.45

1.00

1.80

1.80

1206L150SLYR

3.00 3.40 1.50

1.80 0.40 0.70 0.25

0.75

0.10

0.45

1.00

1.80

1.80

1210L200SLYR

3.00 3.43 2.35 2.80 0.40 0.70 0.25

0.75

0.20

0.50

1.00

2.00

2.50

1210L350SL-SYR

3.00 3.43 2.35 2.80 0.60 1.00

0.25

0.75

0.20

0.50

1.00

2.00

2.50

1812L190SLPR

4.37 4.73 3.07 3.41 0.40 0.70 0.30

1.20

0.25

0.65

1.78

3.45

3.15

C

Top

View

Side

View

Bottom

View

D

Marking code varies by device --

See Electrical Characteristics table

E

A

B

FF

Solder Pad Layout

Device Dimensions

H

G