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44300-0600 Datasheet(PDF) 2 Page - MolexKits

Part # 44300-0600
Description  Includes EBBI 50D, SPOX BMI, Micro-Fit 3.0 BMI, Mini-Fit BMI Product Families.Pitches range: 1.27mm (.050)" - 4.2mm (.165)"||" "346963
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Manufacturer  MOLEXKITS [MolexKits]
Direct Link  http://www.molexkits.com
Logo MOLEXKITS - MolexKits

44300-0600 Datasheet(HTML) 2 Page - MolexKits

  44300-0600 Datasheet HTML 1Page - MolexKits 44300-0600 Datasheet HTML 2Page - MolexKits 44300-0600 Datasheet HTML 3Page - MolexKits 44300-0600 Datasheet HTML 4Page - MolexKits 44300-0600 Datasheet HTML 5Page - MolexKits  
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1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0146
Features and Benefits
Applications
• First-mate/last-break circuits
provide sequential engagement of
contacts for design flexibility
• Robust alignment features virtually
eliminate contact damage
• Very low profile
• Panel mounting feature permits up to
3.00mm (.120") misalignment in horizontal
and vertical directions permiting blind-
mating of products as connectors can self-
align
• Anti-fishhooking design
• Polarized guide posts on ends provide
generous 2.0mm radial lead-in for blind
mating
• Chamfered lead-in on tails for PCB
mounting
• Press-fit retention pegs for mechanical
hold down before and after processing
• Surface Mount Compatible
• Polarized D-shape leaf contact for parallel
board packaging
• Mates to standard .062" PCB card edge
• Telecommunications
-Hubs
-Servers
-Routers
• Other Markets
-Fan-tray assemblies
-Low-current blind-mating applications
-Lower-current power supply applications
• Consumer (General)
• Vending and Gaming
• Business Machines
• High-End Computer
• Production Equipment
SPOX BMI connectors offer self-aligning features in one of the smallest blind-mate
packages available. The unique low-profile design of the SPOX Blind-mate
Interface (BMI) allows for a mated stack distance of only 11.00mm (0.430").
Utilizing proven SPOXstyle contacts for high reliability, the products are suitable for
situations requiring highly reliable tin interfaces.
The Molex EBBI 50D series meets the market demand for low-cost, unshielded,
high density, leaf-style connectors. Leaf-style terminals are arranged in two rows on
.050" spacing within a polarized "D"- shaped housing for rugged mechanical
protection. Housings are made of high-temperature, UL 94V-0 thermoplastic.
Terminals are plated with 30 micro-inches min. gold in the mating area for long
term reliability and durability.
The Mini-Fit BMI is designed for high current/ high density applications requiring the
blind mating of modules, subassemblies or printed circuit boards. The Mini-Fit BMI
allows a misalignment of up to .100". It is appropriate for both power and signal
applications as it can carry currents of up to 9.0A per circuit and has a
10mW contact resistance.
Micro-Fit 3.0 BMI™ 3.00mm (.118") pitch connectors are the perfect choice
when you need compact connectors that carry up to 5 amperes of current.
Product Highlights
For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com
Page 2 of 5


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