2004 Aug 06

4

NXP Semiconductors

Product data sheet

NPN resistor-equipped transistors;

R1 = 2.2 k

Ω, R2 = 2.2 kΩ

PDTC123E series

ORDERING INFORMATION

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

Notes

1.

Refer to standard mounting conditions.

2.

Reflow soldering is the only recommended soldering method.

3.

Refer to SOT883 standard mounting conditions; FR4 with 60

μm copper strip line.

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

PDTC123EE

−

plastic surface mounted package; 3 leads

SOT416

PDTC123EEF

−

plastic surface mounted package; 3 leads

SOT490

PDTC123EK

−

plastic surface mounted package; 3 leads

SOT346

PDTC123EM

−

leadless ultra small package; 3 solder lands; body 1.0

× 0.6 ×

0.5 mm

SOT883

PDTC123ES

−

plastic single-ended leaded (through hole) package; 3 leads

SOT54

PDTC123ET

−

plastic surface mounted package; 3 leads

SOT23

PDTC123EU

−

plastic surface mounted package; 3 leads

SOT323

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

collector-base voltage

open emitter

−

50

V

collector-emitter voltage

open base

−

50

V

emitter-base voltage

open collector

−

10

V

input voltage

positive

−

+12

V

negative

−

−10

V

output current (DC)

−

100

mA

peak collector current

−

100

mA

total power dissipation

SOT54

note 1

−

500

mW

SOT23

note 1

−

250

mW

SOT346

note 1

−

250

mW

SOT323

note 1

−

200

mW

SOT416

note 1

−

150

mW

SOT490

notes 1 and 2

−

250

mW

SOT883

notes 2 and 3

−

250

mW

storage temperature

−65

+150

°C

junction temperature

−

150

°C

operating ambient temperature

−65

+150

°C