PCF2120_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 5 February 2008

11 of 14

NXP Semiconductors

PCF2120

Quartz oscillator

window for a mix of large and small components on one board

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

Table 8.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm)

Package reflow temperature (

°C)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

220

Table 9.

Lead-free process (from J-STD-020C)

Package thickness (mm)

Package reflow temperature (

°C)

< 350

350 to 2000

> 2000

< 1.6

260

260

260

1.6 to 2.5

260

250

245

> 2.5

250

245

245

MSL: Moisture Sensitivity Level

Fig 11. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature