PCA9670_2

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 02 — 17 July 2007

4 of 28

NXP Semiconductors

PCA9670

6.2 Pin description

[1]

pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and

board-level performance, the exposed pad needs to be soldered to the board using a corresponding

thermal pad on the board, and for proper heat conduction through the board thermal vias need to be

incorporated in the PCB in the thermal pad region.

Table 2.

Pin description

Symbol

Pin

Description

SO16, TSSOP16

HVQFN16

AD0

1

15

address input 0

AD1

2

16

address input 1

AD2

3

1

address input 2

P0

4

2

quasi-bidirectional I/O 0

P1

5

3

quasi-bidirectional I/O 1

P2

6

4

quasi-bidirectional I/O 2

P3

7

5

quasi-bidirectional I/O 3

86[1]

supply ground

P4

9

7

quasi-bidirectional I/O 4

P5

10

8

quasi-bidirectional I/O 5

P6

11

9

quasi-bidirectional I/O 6

P7

12

10

quasi-bidirectional I/O 7

RESET

13

11

reset input (active LOW)

SCL

14

12

serial clock line

SDA

15

13

serial data line

16

14

supply voltage