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XC6223C121GR-G Datasheet(PDF) 30 Page - Torex Semiconductor |
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XC6223C121GR-G Datasheet(HTML) 30 Page - Torex Semiconductor |
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30 / 36 page 
30/36 XC6223 Series ● SSOT-24 Power Dissipation Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 500 85 200 200.00 ■ PACKAGING INFORMATION (Continued) Power dissipation data for the SSOT-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 2. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient temperature Evaluation Board (Unit: mm) |
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