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XC6223C121GR-G Datasheet(PDF) 29 Page - Torex Semiconductor |
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XC6223C121GR-G Datasheet(HTML) 29 Page - Torex Semiconductor |
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29 / 36 page 
29/36 XC6223 Series ● USP-4 Power Dissipation Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 85 400 100.00 ■ PACKAGING INFORMATION (Continued) Power dissipation data for the USP-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient temperature Pd vs Ta 0 200 400 600 800 1000 1200 25 45 65 85 105 125 Ambient Temperature Ta（℃） Evaluation Board (Unit: mm) |
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