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PBLS6021D Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PBLS6021D
Description  60 V, 1.5 A PNP BISS loadswitch
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PBLS6021D Datasheet(HTML) 3 Page - NXP Semiconductors

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PBLS6021D_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 12 August 2009
3 of 16
NXP Semiconductors
PBLS6021D
60 V, 1.5 A PNP BISS loadswitch
5.
Limiting values
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
TR1; PNP low VCEsat transistor
VCBO
collector-base voltage
open emitter
-
−60
V
VCEO
collector-emitter voltage
open base
-
−60
V
VEBO
emitter-base voltage
open collector
-
−5V
IC
collector current
-
−1.5
A
ICM
peak collector current
single pulse;
tp ≤ 1ms
-
−3A
IB
base current
-
−300
mA
IBM
peak base current
single pulse;
tp ≤ 1ms
-
−1A
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
370
mW
[2] -
480
mW
[3] -
630
mW
TR2; NPN resistor-equipped transistor
VCBO
collector-base voltage
open emitter
-
50
V
VCEO
collector-emitter voltage
open base
-
50
V
VEBO
emitter-base voltage
open collector
-
10
V
VI
input voltage
positive
-
+12
V
negative
-
−10
V
IO
output current
-
100
mA
ICM
peak collector current
single pulse;
tp ≤ 1ms
-
100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
[1][2]
[3]
-
200
mW
Per device
Ptot
total power dissipation
Tamb ≤ 25 °C
[1] -
480
mW
[2] -
590
mW
[3] -
760
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C


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