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MFRC522 Datasheet(PDF) 86 Page - NXP Semiconductors |
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MFRC522 Datasheet(HTML) 86 Page - NXP Semiconductors |
86 / 96 page MFRC522_34 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3.4 — 5 March 2010 112134 86 of 96 NXP Semiconductors MFRC522 Contactless reader IC Detailed package information can be found at: http://www.nxp.com/package/SOT617-1.html. 18. Handling information Moisture Sensitivity Level (MSL) evaluation has been performed according to SNW-FQ-225B rev.04/07/07 (JEDEC J-STD-020C). MSL for this package is level 1 which means 260 °C convection reflow temperature. Dry pack is not required. Unlimited out-of-pack floor life at maximum ambient 30 °C/85 % RH. 19. Packing information Fig 34. Packing information 1 tray 001aaj740 strap 46 mm from corner tray chamfer PIN 1 chamfer PIN 1 printed piano box ESD warning preprinted barcode label (permanent) barcode label (peel-off) QA seal Hyatt patent preprinted The straps around the package of stacked trays inside the piano-box have sufficient pre-tension to avoid loosening of the trays. In the traystack (2 trays) only ONE tray type* allowed *one supplier and one revision number. |
Similar Part No. - MFRC522_10 |
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Similar Description - MFRC522_10 |
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