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ICM7555 Datasheet(PDF) 22 Page - NXP Semiconductors

Part No. ICM7555
Description  General purpose CMOS timer
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Maker  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo NXP - NXP Semiconductors

ICM7555 Datasheet(HTML) 22 Page - NXP Semiconductors

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NXP Semiconductors
ICM7555
General purpose CMOS timer
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 August 2009
Document identifier: ICM7555_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
19. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 3
7.1
Function selection. . . . . . . . . . . . . . . . . . . . . . . 3
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
9
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
10
Typical performance curves . . . . . . . . . . . . . . . 6
11
Application information. . . . . . . . . . . . . . . . . . 11
11.1
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
11.2
Power supply considerations . . . . . . . . . . . . . 11
11.3
Output drive capability . . . . . . . . . . . . . . . . . . 11
11.4
Astable operation . . . . . . . . . . . . . . . . . . . . . . 12
11.5
Monostable operation . . . . . . . . . . . . . . . . . . . 12
11.6
Control voltage . . . . . . . . . . . . . . . . . . . . . . . . 13
11.7
RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
13
Soldering of SMD packages . . . . . . . . . . . . . . 16
13.1
Introduction to soldering . . . . . . . . . . . . . . . . . 16
13.2
Wave and reflow soldering . . . . . . . . . . . . . . . 16
13.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16
13.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17
14
Soldering of through-hole mount packages . 18
14.1
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
14.2
Soldering by dipping or by solder wave . . . . . 18
14.3
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18
14.4
Package related soldering information . . . . . . 19
15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19
16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
17.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
17.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
17.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
17.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
18
Contact information. . . . . . . . . . . . . . . . . . . . . 21
19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22


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