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IT3M-180P-28H03 Datasheet(PDF) 1 Page - Hirose Electric

Part # IT3M-180P-28H03
Description  High-Speed(10Gbps) BGA Mezzanine Connectors
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Manufacturer  HIROSE [Hirose Electric]
Direct Link  http://www.hirose-connectors.com
Logo HIROSE - Hirose Electric

IT3M-180P-28H03 Datasheet(HTML) 1 Page - Hirose Electric

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1
High-Speed(10+Gbps) BGA Mezzanine Connectors
IT3 Series
2010.02
sFlexibility
Hirose’s IT3 mezzanine connector system is as
comfortable in today’s data rates of PCIe and XAUI
as it is in tomorrow’s 10+Gbps systems.
With the ability to transmit differential, single-ended,
and power through one package and being stackable
from 15 – 40mm, IT3 can solve your interface needs
for both current and future generations.
sMechanical features
q Unique 3-piece structure for flexibility
q Stacking heights from 15 to 40mm
(
*
*15mmH is 2-piece)
q Staggered 1.5mm ∞
∞ 1.75mm ball grid array
q Number of Contacts: 100, 200, &300 signals
+ 90% additional grounds
q Differential, single-ended, and power
q Low mating/extracting forces
q Wide misalignment tolerances for multiple
connector use
q Both of SnPb and Pb-free are available
q Excellent reflow solderability
sSignal integrity features
q Insertion loss to Crosstalk Ratio (ICR)
The ICR performance meets the extrapolated
IEEE 802.3ap specification for 6.25Gbps with
fully-populated pin assignment, and 10+Gbps
with skipped pin assignment.
q Return Loss
The differential return loss meets the
extrapolated IEEE 802.3ap specification
up to 12GHz.
Interposer
Signal / Ground Configuration
Signal
Ground
Stacking Height
Contact Position
17mm
20mm
22mm
25mm
26mm
28mm
30mm
32mm
38mm
40mm
100
200
300
*
*
*
*
0
5
10
15
20
0
10
20
30
40
50
60
Frequency (GHz)
ICR
IEEE spec
0
5
10
15
20
-50
-40
-30
-20
-10
0
Frequency (GHz)
RL
IEEE Spec
sStacking height variations
* : Under planning
NEW


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